CEVA Introduces CEVA-TeakLite-4 -- The Most Powerful, Low Power 32-bit DSP Architecture Framework for Advanced Audio and Voice Applications
SAN JOSE, Calif., April 16, 2012 /PRNewswire/ -- Linley Tech Mobile Conference – CEVA, Inc. (NASDAQ: CEVA) the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today introduced the CEVA-TeakLite-4, the industry's most powerful, low power and scalable 32-bit DSP architecture framework for advanced audio and voice applications.
CEVA-TeakLite-III Becomes Industry's First DSP Core to Offer Optimized Skype SILK Super Wideband Speech Codec
MOUNTAIN VIEW, Calif., April 3, 2012 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of the industry's first implementation of the popular Skypeâ„¢ SILKâ„¢ super wideband speech codec on a DSP core.
Add crystal clear audio to microcontroller-based applications with TI's new Audio Capacitive Touch BoosterPack for ultra-low-power MSP430â„¢ microcont
SILICON VALLEY, Calif., March 27, 2012 /PRNewswire/ -- Enabling new functionalities in microcontroller applications, including crystal clear audio with playback and recording capabilities, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the C5000â„¢ ultra-low-power digital signal processor (DSP)-based Audio Capacitive Touch BoosterPack.